? 2017 kingbright. all rights reserved. spec no: dsam8409 / 1301002031 rev no: v.2a date: 09/27/2017 page 1 / 5 descriptions z the green source color devices are made with algainp on gaas substrate light emitting diode z electrostatic discharge and power surge could damage the leds z it is recommended to use a wrist band or anti-electrostatic glove when handling the leds z all devices, equipments an d machineries must be electrically grounded features z 1.0 inch digit height z low current operation z excellent character appearance z high light output z easy mounting on p.c. boards or sockets z mechanically rugged z standard: gray face, white segment z rohs compliant applications z home and smart appliances z display time and digital combination z industrial and instrumental applications z numeric status attention observe precautions for handling electrostatic discharge sensitive devices package dimensions SA10-21CGKWA 25.4 mm (1.0 inch) single digit numeric display notes: 1. all dimensions are in millimeters (inches), tolerance is 0.25(0.01")unless otherwise noted. 2. the specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. selection guide part number emitting color (material) lens type iv (ucd) @ 10ma [1] min. typ. SA10-21CGKWA green (algainp) white diffused 52000 95000 common anode, rt. hand decimal *14000 *33000 description notes: 1. luminous intensity / luminous flux: +/-15%. * luminous intensity value is traceable to cie127-2007 standards.
? 2017 kingbright. all rights reserved. spec no: dsam8409 / 1301002031 rev no: v.2a date: 09/27/2017 page 2 / 5 absolute maximum ratings at t a =25c electrical / optical characteristics at t a =25c SA10-21CGKWA notes: 1. 1/10 duty cycle, 0.1ms pulse width. 2. 2mm below package base. 3. relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static e lectricity ? ref jedec/jesd625-a and jedec/j-std-033. parameter symbol value unit power dissipation (per chip) p d 75 mw reverse voltage (per chip) v r 5 v junction temperature t j 115 c operating temperature t op -40 to +85 c storage temperature t stg -40 to +85 c dc forward current (segment) dc forward current (dp) i f 30 30 ma peak forward current (segment) peak forward current (dp) i fm [1] 150 150 ma electrostatic dischar ge threshold (hbm) - 3000 v lead solder temperature [2] 260c for 3-5 seconds parameter symbol emitting color value unit typ. max. wavelength at peak emission i f = 10ma peak green 574 - nm dominant wavelength i f = 10ma dom [1] green 570 - nm spectral bandwidth at 50% rel max i f = 10ma ? green 20 - nm capacitance c green 15 - pf forward voltage i f = 10ma (segment) forward voltage i f = 10ma (dp) v f [2] green 4 2 4.9 2.45 v reverse current (v r = 5v) (per chip) i r green - 10 ua notes: 1. the dominant wavelength ( d) above is the setup value of the sorting machine. (tolerance d : 1nm. ) 2. forward voltage: 0.1v. 3. wavelength value is traceable to cie127-2007 standards. 4. excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradat ion or premature failure.
? 2017 kingbright. all rights reserved. spec no: dsam8409 / 1301002031 rev no: v.2a date: 09/27/2017 page 3 / 5 0 4 8 12 16 20 1.8 1.9 2.0 2.1 2.2 2.3 t a = 25 c forward voltage (v) forward current (ma) 0.0 1.0 2.0 3.0 4.0 5.0 0 1020304050 t a = 25 c forward current (ma) luminous intensity normalised at 10 ma 0 10 20 30 40 50 -40-20 0 20406080100 ambient temperature (c) permissible forward current (ma) 0.0 0.5 1.0 1.5 2.0 2.5 -40-200 20406080100 ambient temperature (c) luminous intensity normalised at t a = 25 c 0 4 8 12 16 20 3.8 3.9 4.0 4.1 4.2 4.3 t a = 25 c forward voltage (v) forward current (ma) 0.0 1.0 2.0 3.0 4.0 5.0 0 1020304050 t a = 25 c forward current (ma) luminous intensity normalised at 10 ma 0 10 20 30 40 50 -40-20 0 20406080100 ambient temperature (c) permissible forward current (ma) 0.0 0.5 1.0 1.5 2.0 2.5 -40-200 20406080100 ambient temperature (c) luminous intensity normalised at t a = 25 c 0% 20% 40% 60% 80% 100% 350 400 450 500 550 600 650 700 750 800 t a = 25 c green wavelength (nm) relative intensity (a. u.) technical data green (segment) SA10-21CGKWA relative intensity vs. wavelength forward current vs. forward voltage luminous intensity vs. forward current forward current derating curve luminous intensity vs. ambient temperature green (dp) forward current vs. forward voltage luminous intensity vs. forward current forward current derating curve luminous intensity vs. ambient temperature
? 2017 kingbright. all rights reserved. spec no: dsam8409 / 1301002031 rev no: v.2a date: 09/27/2017 page 4 / 5 SA10-21CGKWA recommended wave soldering profile soldering general notes 1. through-hole displays are incompatible with reflow soldering. 2. if components will undergo multiple soldering processes, or other processes where the components may be subjected to intense heat, please check with kingbright for compatibility. cleaning 1. mild "no-clean" fluxes are recommended for use in soldering. 2. if cleaning is required, kingbright recommends to wash components with water only. do not use harsh organic solvents for cleaning because they may damage the plastic parts . 3. the cleaning process should take place at room temperature and the devices should not be washed for more than one minute. 4. when water is used in the cl eaning process, immediately remove excess mois ture from the component with forced-air drying afterwards. notes: 1. recommend pre-heat temperature of 105c or less (as measured with a thermocouple attached to the led pins) prior to immersion in the solder wave with a maximum solder bath temperature of 260c 2. peak wave soldering temperature between 245c ~ 255cfor 3 sec (5 sec max). 3. do not apply stress to the epoxy resin while the temperature is above 85c. 4. fixtures should not incur stress on the component when mounting and during soldering process. 5. sac 305 solder alloy is recommended. 6. no more than one wave soldering pass. 7. during wave soldering, the pcb top-surface temperature should be kept below 105c. packing & label specifications through hole display mounting method lead forming 1. do not bend the component leads by hand without proper tools. the leads should be bent by clinching the upper part of the lead firmly such that the bending force is not exerted on the plastic body. installation 1. the installation process should not apply stress to the lead terminals. 2. when inserting for assembly, ensure the terminal pitch matches the substrate board's hole pitch to prevent spreading or pinc hing the lead terminals. (fig.1) 3. the component shall be placed at least 5mm from edge of pcb to avoid damage caused excessive heat during wave soldering . (fig.2)
? 2017 kingbright. all rights reserved. spec no: dsam8409 / 1301002031 rev no: v.2a date: 09/27/2017 page 5 / 5 SA10-21CGKWA circuit design notes 1. protective current-limiting resist ors may be necessary to operate the leds within the specified range. 2. leds mounted in parallel should each be placed in series with its own current-limiting resistor .(fig.3) 3. the driving circuit should be design ed to protect the led against reverse voltages and transient voltage spikes when the circuit is powered up or shut down. 4. the safe operating current should be chosen after considering the maximum ambient temperature of the operating environment. 5. prolonged reverse bias should be avoided, as it could cause metal migration, leading to an increase in leakage current or causing a short circuit. precautionary notes 1. the information included in this document reflects representative usage scenarios and is intended for technical reference on ly. 2. the part number, type, and specifications mentioned in this document are subject to future change and improvement without no tice. before production usage customer should refer to the latest datasheet for the updated specifications. 3. when using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. if customer usage exceeds the specified limits, kingbright will not be responsible for any subsequent issues. 4. the information in this document applies to typical usage in consumer electronics applications. if customer's application ha s special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with kingbright representative for further assistance. 5. the contents and information of this document may not be reproduced or re-transmitted without permission by kingbright. 6. all design applications should refer to kingbright application notes available at http://www.kingbrightusa.com/applicationnotes
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